The Xiaomi Mi 6 has been long anticipated and over the months we have seen plenty of leaks and revelations about the flagship smartphone. Last week, we came across reports indicating the use of the chipset. Now, thanks to an alleged render, we have an idea about how the purported smartphone will look like. Based on the leaked renders, what will set apart the Mi 6 from its predecessors is a near bezel-less display with a curved rear design.
The renders of the Mi 6 has been leaked by a Weibo user and show off the smartphone in an all-black design. Going by the renders, the flagship smartphone will come with narrow side bezels and a slightly curved rear panel which resembles the Mi Note 2. In addition to the edge-to-edge display, there will be a home button on the front and a dual-camera module at the back. It is difficult to judge based on the renders if the company is opting for ceramic as the material for the Mi 6. However, the choice of a glossy black on black design would bring the flagship smartphone at par with the current line of Apple iPhone 7 and the upcoming Samsung Galaxy S8.
Interestingly, the latest leak is in contrast with previously leaked set of live images. The older images hinted at a flat rear panel in a matte finish, along with a single camera module. Although there is no official word on the smartphone’s design or specifications, it is believed that Xiaomi will be introducing up to three variants of the Mi 6. So, the one with the flatter rear panel could possibly be one of the rumored models. ALSO READ: Xiaomi Mi 6 with Snapdragon 835 SoC could launch on April 16; here’s everything we know so far
Talking about the specifications, the Mi 6 is expected to boast a 5.2-inch LCD display with a 2.5D curved glass for protection. Some reports indicate that one of the rumored variants could come with a dual-curved display with full HD resolution while another will come with quad HD resolution. While earlier it was believed that Mi 6 will be one of the flagship smartphones of the year to use the advanced Qualcomm Snapdragon 835 chipset, according to a latest report by AndroidPure, Xiaomi will be using last year’s Snapdragon 821 SoC. Now, some reports also indicate that Xiaomi might use the MediaTek Helio X30 chipset as per the launch region. The lowest variant is said to come with 4GB of RAM and 32GB internal storage and the mid-variant with 4GB of RAM and 64GB storage. The high-end variant with the ceramic body is said to come with 6GB of RAM and 128GB internal storage.
For photography, the Mi 6 is expected to come with camera functionalities similar to that of the recently launched Sony Xperia XZ smartphone. It is rumored that the Mi 6 will pack a 12-megapixel Sony IMX386 sensor with 4K video recording capabilities and dual-tone LED flash, along with an 8-megapixel Sony IMX268 selfie camera. However, if one is to take into account the latest leaked renders then the smartphone could in fact boast a dual camera module. It could come fuelled with a 3,000mAh battery and come with Type-C support. On the software front, the Mi 6 is expected to run Android 7.0 Nougat with MIUI OS layered above.
Although there is no official word, but it is expected that Xiaomi will take the wraps off its Mi 6 on April 16. The pricing of the Mi 6 has also been suggested which will start at CNY 1,999 (Rs 19,400 approximately). The high-end version with ceramic body is expected to be priced at CNY 2,500 (Rs 24,200 approximately).
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